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Jul 10, 2002
ChipMOS/Bermuda Announces New High-Speed Wafer Test Technology
ChipMOS/Bermuda Announces New High-Speed Wafer Test Technology
ChipMOS/Bermuda Announces New High-Speed Wafer Test TechnologyHsinchu, Taiwan, July 10, 2002 - ChipMOS TECHNOLOGIES (Bermuda) LTD. (Nasdaq: IMOS) ("ChipMOS/Bermuda") today announced the successful development of new high-speed wafer test technology for probe testing 32 in parallel DDR (double data rate) DRAM at 200 MHz clock rates and 400 megabit data rates. The breakthrough project, financially supported by the Taiwanese government, was realized through technological collaboration between ChipMOS and three of its major suppliers in this field--Teradyne, Tokyo Electron Ltd. ("TEL"), and FormFactor, Inc. ("FormFactor").
The need for increased wafer testing speed is driven by the rising demand for "known good dies" that are being used to fuel production of consumer electronics products such as video enabled cell phones and other mobile communications applications. To satisfy this need, testing and design experts from ChipMOS, Teradyne, TEL and FormFactor jointly developed and conducted the high-speed wafer level development project. The technology was developed using Teradyne's Probe-One Memory Test System, TEL's P12XL Prober, and FormFactor's BladeRunnerTM technology area array probe cards.
"I am pleased to see the successful launch of our high-speed wafer test technology, and really appreciate the full support from Teradyne, TEL and FormFactor on this project during the past two years. The high-speed wafer test technology is an important accomplishment as it reduces the cost of testing for our clients and increases the chip yields significantly," said S.J. Cheng, Deputy Chairman and Chief Executive Officer of ChipMOS/Bermuda.
"The key to this technology is that it helps uncover more known-good dies and eliminate defective chips before they go on for packaging or to the next process. As a result, we can integrate wafer level assembly and full contact wafer level burn-in to provide our customers with more comprehensive services. ChipMOS now has a pilot line for 200mm and 300mm wafers in place and a skilled engineering team ready to help customers moving to this technology. This leading technology is expected to further solidify our relationship with major customers" added Mr. Cheng.
ChipMOS/Bermuda has had a strong ongoing commitment to technology development since its establishment. In 1999 and 2000, the Company spent at least 4% of net revenues in each year on research and development, and in 2001, ChipMOS spent 8% of net revenues on research and development. The success of this investment is consistently reflected in the high number of patents that the Company has had registered and certified in the past few years. ChipMOS now holds 123 patents in Taiwan, 2 in Japan and 3 in the United States. In addition, ChipMOS has received subsidies from the Taiwanese government for 4 technological development projects since 1999 with a total subsidy amount of NTD 90million. ChipMOS/Bermuda will continue investing on research and development to enhance its technology and provide customers with leading edge solutions.
About ChipMOS TECHNOLOGIES (Bermuda) LTD.:
ChipMOS/Bermuda is a leading provider of semiconductor testing and assembly services to customers in Taiwan, Japan and the U.S. With advanced facilities in the Hsinchu and Tainan Science-Based Industrial Parks in Taiwan, ChipMOS/Bermuda and its subsidiaries provide testing and assembly services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries. For more information, please visit its company website at http://www.chipmos.com.tw/
The need for increased wafer testing speed is driven by the rising demand for "known good dies" that are being used to fuel production of consumer electronics products such as video enabled cell phones and other mobile communications applications. To satisfy this need, testing and design experts from ChipMOS, Teradyne, TEL and FormFactor jointly developed and conducted the high-speed wafer level development project. The technology was developed using Teradyne's Probe-One Memory Test System, TEL's P12XL Prober, and FormFactor's BladeRunnerTM technology area array probe cards.
"I am pleased to see the successful launch of our high-speed wafer test technology, and really appreciate the full support from Teradyne, TEL and FormFactor on this project during the past two years. The high-speed wafer test technology is an important accomplishment as it reduces the cost of testing for our clients and increases the chip yields significantly," said S.J. Cheng, Deputy Chairman and Chief Executive Officer of ChipMOS/Bermuda.
"The key to this technology is that it helps uncover more known-good dies and eliminate defective chips before they go on for packaging or to the next process. As a result, we can integrate wafer level assembly and full contact wafer level burn-in to provide our customers with more comprehensive services. ChipMOS now has a pilot line for 200mm and 300mm wafers in place and a skilled engineering team ready to help customers moving to this technology. This leading technology is expected to further solidify our relationship with major customers" added Mr. Cheng.
ChipMOS/Bermuda has had a strong ongoing commitment to technology development since its establishment. In 1999 and 2000, the Company spent at least 4% of net revenues in each year on research and development, and in 2001, ChipMOS spent 8% of net revenues on research and development. The success of this investment is consistently reflected in the high number of patents that the Company has had registered and certified in the past few years. ChipMOS now holds 123 patents in Taiwan, 2 in Japan and 3 in the United States. In addition, ChipMOS has received subsidies from the Taiwanese government for 4 technological development projects since 1999 with a total subsidy amount of NTD 90million. ChipMOS/Bermuda will continue investing on research and development to enhance its technology and provide customers with leading edge solutions.
About ChipMOS TECHNOLOGIES (Bermuda) LTD.:
ChipMOS/Bermuda is a leading provider of semiconductor testing and assembly services to customers in Taiwan, Japan and the U.S. With advanced facilities in the Hsinchu and Tainan Science-Based Industrial Parks in Taiwan, ChipMOS/Bermuda and its subsidiaries provide testing and assembly services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries. For more information, please visit its company website at http://www.chipmos.com.tw/