Apr 10, 2024

ChipMOS REPORTS 17.7% YoY INCREASE IN 1Q24 REVENUE AND 5.2% YoY INCREASE IN MARCH 2024 REVENUE

HSINCHU, April 10, 2024 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported its unaudited consolidated revenue for the month of March 2024 and for the first quarter ended March 31, 2024. All U.S. dollar figures cited in this press release are based on the exchange rate of NT$31.93 to US$1.00 as of March 29, 2024.

Revenue for the first quarter of 2024 was NT$5,418.7 million or US$169.7 million, representing a decrease of 5.4% from the fourth quarter of 2023, and an increase of 17.7% from the first quarter of 2023. The Company noted that it is benefitting from further inventory stabilization and demand recovery in its memory products.

Revenue for the month of March 2024 was NT$1,933.2 million or US$60.5 million, representing an increase of 8.8% from February 2024, and an increase of 5.2% from March 2023.

Consolidated Monthly Revenues (Unaudited)


March 2024

February 2024

March 2023

MoM Change

YoY Change

Revenues

   (NT$ million)

1,933.2

1,777.1

1,837.7

8.8 %

5.2 %

Revenues

   (US$ million)

60.5

55.7

57.6

8.8 %

5.2 %

 

Consolidated Quarterly Revenues (Unaudited)


First Quarter

2024

Fourth Quarter

2023

First Quarter

2023

QoQ Change

YoY Change

Revenues

   (NT$ million)

5,418.7

5,725.4

4,605.1

-5.4 %

17.7 %

Revenues

   (US$ million)

169.7

179.3

144.2

-5.4 %

17.7 %

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS) (www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS is known for its track record of excellence and history of innovation. The Company provides end-to-end assembly and test services to leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries serving virtually all end markets worldwide. 

Forward-Looking Statements:

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as 'believes,' 'expects,' 'anticipates,' 'projects,' 'intends,' 'should,' 'seeks,' 'estimates,' 'future' or similar expressions or by discussion of, among other things, strategies, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors. Further information regarding these risks, uncertainties and other factors are included in the Company's most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange Commission (the "SEC") and in the Company's other filings with the SEC.

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

IR@chipmos.com 

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com 

 

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SOURCE ChipMOS TECHNOLOGIES INC.