Jan 26, 2006

ChipMOS And RYOWA Enter Into BGA Substrate Supply Agreement

HSINCHU, Taiwan, Jan. 26, 2006 - ChipMOS TECHNOLOGIES (Bermuda) LTD. ("ChipMOS") (Nasdaq: IMOS) announced today that its 69.8% owned subsidiary, ChipMOS TECHNOLOGIES INC. ("ChipMOS Taiwan"), has signed a BGA (Ball Grid Array) substrate supply agreement with RYOWA CO., LTD. ("RYOWA"), a major supplier. Under this one-year supply agreement, RYOWA will provide a minimum of 30 million pieces of BGA substrates per month. This will be used mainly for manufacturing DDR II memory packages.

S.J. Cheng, Chairman and Chief Executive Officer of ChipMOS, said, "We are encouraged to see the recent pick-up in DDR II memory finally happening after several years of delays. This will likely become mainstream around the end of first half of this year. Based on our customers' current forecasts, it was necessary to secure a high quality, high volume supply of BGA substrate to meet the anticipated increasing demand for DDR II packaging."

About ChipMOS TECHNOLOGIES (Bermuda) LTD.:

ChipMOS ( http://www.chipmos.com.tw/ ) is a leading independent provider of semiconductor testing and assembly services to customers in Taiwan, Japan, and the U.S. With advanced facilities in Hsinchu and Southern Taiwan Science Parks in Taiwan and Shanghai, ChipMOS and its subsidiaries provide testing and assembly services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries.

Forward-Looking Statements

Certain statements contained in this announcement may be viewed as "forward-looking statements" within the meaning of Section 27A of the U.S. Securities Act of 1933, as amended, and Section 21E of the U.S. Securities Exchange Act of 1934, as amended. Such forward-looking statements involve known and unknown risks, uncertainties and other factors, which may cause the actual performance, financial condition or results of operations of the Company to be materially different from any future performance, financial condition or results of operations implied by such forward-looking statements. Further information regarding these risks, uncertainties and other factors is included in the Company's most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange Commission (the "SEC") and in the Company's other filings with the SEC.

Contact:

In Taiwan
Dr. S.K. Chen
ChipMOS TECHNOLOGIES (Bermuda) LTD. 
Tel: +886-6-507-7712
 Email: s.k._chen@chipmos.com.tw

In the U.S.
David Pasquale
The Ruth Group
Tel: +1-646-536-7006
Email: dpasquale@theruthgroup.com